focusses on technical consulting in enabling production
and quality assessment:
Advanced Electronic Packaging
Impedance Controlled Microjoining Technology
- Vacuum Wafer Bonding
- Ultra high resolution hermeticity testing
- Dicing & Thinning Technology
- Quality Assessment
and failure root cause analysis
of production outsourcing partner
New Site Under Construction
We thank you very much for your interest
in our service offers.
The site you have requested is still under construction.
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For direct contact please email to: email@example.com
Dr.-Ing. Dipl.-Phys. Wolfgang Reinert
Kieler Str. 370